Data Analysis, Data-driven decision-making, Analysis software tools, Statistics, 3D NAND technology, Dry Etch process development, AI-driven solutions

Statistical Analysis, Sql, Visual Basic, Process Modeling, Rms, Python, Spc, FDC, E3, R, Doe, Dashboard development

Dry Etch process development, Statistics, AI-driven solutions, Analysis software tools, Data Analysis, Data-driven decision-making

Space, Measurement instruments, Fmea, Ms Office Applications, CAMSTAR PROMIS MES DC OP, SPC charts, Jmp

Testing, process DOE, Process Engineering

Ansible, Networking, Dns, Openshift, Load Balancing, Linux Servers, Scripting, virtualization, Kubernetes, Python, Bash, routing, Helm, Docker, Vpn, Terraform, Git, Firewalls, CI CD

Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, System-in-Package SiP, Warpage characterization, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans