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Skills:
process qualification , Statistical Analysis, Photoresist coating, Overlay accuracy, Control Plans, Pattern fidelity and defectivity, FMEA methodologies, Lift-off lithography processes, Broadband i-line DUV 193 nm aligner stepper scanner platforms, Etch processes, Mask Layout and reticle design, Exposure dose and focus, Process Recipes, Root Cause Analysis, photolithography
