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Skills:
process qualification , Statistical Analysis, Root Cause Analysis, Overlay accuracy, Process Recipes, Control Plans, Exposure dose and focus, Mask Layout and reticle design, Lift-off lithography processes, Photolithography processes, FMEA methodologies, Photoresist coating, Pattern fidelity and defectivity, Broadband i-line DUV 193 nm aligner stepper scanner platforms, Etch processes
