Microsoft Office, ocap, process fine tuning, quality key performance index, Spc, FDC, real-time problem analysis, Engineering Qualification Evaluation, Tpm, wafer fabrication, defect median, recipe alignment, SWR DOE Trial R D, process specifications

Microsoft Office, Agile, Engineering Sample DOE, Fmea, Prototype EVT, Parametric Yield improvement, Programming macro and scripting, Jmp, Statistical Process Control, 7 Qc Tools, defectivity, NPI Prototyping, process integration, Doe, RF filter products, CpK

Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, Warpage characterization, System-in-Package SiP, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans

Solidworks, Matlab, Python, Spc, Autocad, 8D, Six Sigma, dispensing and pick place process, Jmp, Statistical Process Control methodologies, Minitab, data analysis packages, Doe

Matlab, Microsoft Excel, Python, Material characterization, Polymer molding, Data Analysis, JMP programming, Contact non-contact profilers, Metrology, Smartscope