15:I[832,["669","static/chunks/app/(Engagement)/similar-jobs/%5Bid%5D/page-7c4e3a2cee4680ac.js"],"default"] 17:I[5878,["669","static/chunks/app/(Engagement)/similar-jobs/%5Bid%5D/page-7c4e3a2cee4680ac.js"],"Image"] 16:T72f,Job Description:

Job Summary

Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.

Key Responsibilities

Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).
Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
Drive new process integration (NPI) and process transfer to high-volume manufacturing.
Perform root cause analysis and implement robust corrective/preventive actions.
Define process control plans, SPC strategies, and OCAP execution.
Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
Mentor junior engineers and technicians.
Interface with suppliers on process and material improvements.

Qualifications

Bachelor's or Master's degree in Engineering (Electrical, Chemical, Materials, or related).
At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).
Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
Demonstrated leadership in cross-functional technical projects.
Strong analytical, problem-solving, and communication skills

Preferred

PhD in Engineering (Electrical, Chemical, Materials, or related).
Six Sigma certification (Green/Black Belt).
Experience supporting 4 to 6 wafer scaling or equivalent manufacturing transition.

R026529

Wafer Fab Process Engineer