Job Description:
Job Summary
Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.
Key Responsibilities
- Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).
- Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
- Drive new process integration (NPI) and process transfer to high-volume manufacturing.
- Perform root cause analysis and implement robust corrective/preventive actions.
- Define process control plans, SPC strategies, and OCAP execution.
- Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
- Mentor junior engineers and technicians.
- Interface with suppliers on process and material improvements.
Qualifications
- Bachelor's or Master's degree in Engineering (Electrical, Chemical, Materials, or related).
- At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).
- Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
- Demonstrated leadership in cross-functional technical projects.
- Strong analytical, problem-solving, and communication skills
Preferred
- PhD in Engineering (Electrical, Chemical, Materials, or related).
- Six Sigma certification (Green/Black Belt).
- Experience supporting 4 to 6 wafer scaling or equivalent manufacturing transition.
R026529
