thermal oxidation , diffusion, thin film deposition, Fmea, wafer thinning, process control plans, OCAP execution, SPC strategies, metal passivation, implantation, statistical data analysis tools, DOE methodologies

process qualification , Statistical Analysis, ocap, Root Cause Analysis, 5 Why, Overlay accuracy, Process Recipes, Control Plans, Exposure dose and focus, 8D, Mask Layout and reticle design, Lift-off lithography processes, photolithography, Eco, Fishbone, FMEA methodologies, Photoresist coating, Pfmea, Pattern fidelity and defectivity, Etch processes, Broadband i-line DUV 193 nm aligner stepper scanner platforms