About the Company
TFC Communication is a leading provider of optical sub-assembly integrated solutions and advanced optoelectronic package manufacturing services. We specialize in the R&D, production, and sales of high-speed optical components. The company was founded in 2005 and was listed on China's Growth Enterprise Market in 2015. Our products are widely used in fields such as AI, data center, fiber-optic communication, and optical sensing.
About the Role
This role is responsible for the key process management in high speed optical engine product, such Die Bond, Wire Bond, Burn in, Alignment, Test, BGA, Reflow.
Responsibilities
- Be responsible for the key process design such as chip mounting, wire bonding, and dispensing in the new project stage of optical devices like TO, COC, and high-speed BOX.
- Plan the process orthogonal experiments, verify and finalize the robust process to ensure the lean mass production of high-quality and highly reliable products.
- Be responsible for the sample production of optical devices such as COC, high-speed 800G, and optical engines; as well as the evaluation, verification, and introduction of the corresponding key process platforms.
- Support the analysis and solution of process-related problems in the sample mass production stage, and provide process-related improvement plans.
- Be responsible for the process capability analysis, data collation, and analysis in the small-batch production and mass production stages of the project.
- Lead the process-related failure analysis in the new product stage and establish the process failure analysis process guidelines.
- Establish the SPC monitoring mechanism of the process and be responsible for the training of mass production engineers and technicians in the engineering department.
- Be responsible for the preparation of work documents in the stage of sample transfer to mass production, as well as the reduction and optimization of relevant process standard-hours.
Qualifications
- A bachelor's degree or above in related majors such as optoelectronics, electronics, materials, machinery, and communication.
- More than 3 years of work experience in optical fiber industry, familiar with the development process of optical devices, such as chip mounting, wire bonding, reflow soldering, coupling, etc.
- Understand the packaging technology of high-speed optical devices, have experience in semiconductor component chip mounting (eutectic & solid crystal) and wire bonding (ball bonding & wedge bonding), etc. Those with experience in optoelectronic device packaging will be given priority.
- Understand the design and selection of chip mounting nozzles, as well as the selection of ceramic nozzles and the ability to select materials.
- English reading, writing, and communication abilities.
