Technician 3, Engineering

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Set up, calibrate, and operate the alignment machine in accordance with standard operating procedures (SOPs).
• Monitor bond quality and machine performance through visual inspection, dimensional measurements, and shear tests.
• Perform both corrective and preventive maintenance.
• Accurately record process parameters and yield data.
• Assist with continuous improvement efforts related to bonding processes and tooling.
• Strictly follow ESD, safety, and cleanliness protocols.
• Operate AVI systems to inspect completed components for surface defects, alignment issues, and missing elements.
• Load/unload parts from AVI machines and manage inspection results in the system.
• Review flagged defects and escalate any critical quality issues to QA or engineering.
• Perform routine checks and calibration on AVI systems to ensure optimal performance.
• Analyze defect trends and assist engineering teams in root cause analysis and corrective actions.

Qualifications

REQUIRED:

• Diploma in Electrical, Mechanical, Mechatronics, or a related field.
• 24 years of experience in semiconductor/electronics manufacturing, particularly with bonding and inspection tools.
• Familiarity with Alignment bonder machines and AVI platforms.
• Basic mechanical and troubleshooting skills.
• Ability to interpret process documents, drawings, and inspection criteria.

SKILLS:

• Able to work on shift.
• Able to work under high pressure
• Leadership and shift management skills
• Good attitude and positive mindset
• Physically healthy and able to work in shifts
• Advanced skills in Microsoft Word, Excel, Access, and PowerPoint

Additional Information

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