Role Objective
- Design, analyze, and validate thermal solutions for liquid-cooled systems, ensuring reliable heat removal for high-power electronics such as ASICs, GPUs, and PCBA-level devices.
Key Responsibilities
- Perform thermal analysis and simulation (CFD) for liquid cooling systems (cold plate, manifold, CDU)
- Define thermal requirements: TDP, T, P, flow rate, inlet/outlet temperature
- Evaluate and optimize cold plate designs, channel geometry, and flow distribution
- Support thermal testing, validation, and qualification at PCBA and system level
- Conduct hotspot analysis and propose mitigation solutions
- Collaborate with mechanical and electrical engineers for system integration
- Support PFMEA and risk analysis related to thermal performance
- Work with customers to align thermal specs and test conditions
Required Skills & Experience
- Bachelor's or Master's degree in Thermal / Mechanical Engineering or related field
- 5+ years experience in thermal management or cooling solutions
- Hands-on experience with CFD tools (ANSYS, Icepak, Flotherm, or similar)
- Understanding of liquid cooling, heat transfer, and fluid dynamics
- Experience with thermal testing and data correlation
- Strong analytical and problem-solving skills
