Company Overview:
MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.
MACOM has more than 70 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.
MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.
MACOM is an Equal Opportunity Employer.
Manufacturing Engineer, Senior
Job Description:
We are seeking a highly experienced Principal Manufacturing Engineer to lead and drive manufacturing excellence at our OSAT facility in Ayuthaya, Thailand. This role is accountable for end-to-end NPI execution, product transfer across global sites, process development for Hybrid package semiconductor assembly, and aggressive yield optimization. This is not a maintenance role. This is a technical leadership position responsible for stabilizing, scaling, and future-proofing backend semiconductor processes.
Responsibilities:
New Product Introduction (NPI) & Product transfer between sites
- Lead NPI programs from feasibility to mass production.
- Own process readiness, line qualification, and ramp-up performance.
- Drive PFMEA, control plan, and risk mitigation before first shipment.
- Partner with Design, Quality, and Customer Engineering to ensure seamless product introduction.
Process development
- Develop and optimize assembly processes for Hybrid package: Diode package and RF Power package
- Manage DOE, correlation studies, and validation builds.
- Define critical process windows and robust manufacturing guardrails.
- Build scalable and repeatable backend flows for high-mix production.
Yield & continuous improvement
- Drive yield analysis using statistical and data-driven approaches.
- Lead root cause investigations (8D, 5Why, Fishbone).
- Reduce variation, scrap, rework, and cycle time.
Qualifications:
- Bachelor's or Master's Degree in Engineering (Electrical, Mechanical, Materials or related field).
- Minimum 8+ years of experience in Semiconductor Manufacturing, preferably in OSAT environment.
- Proven track record in:
- Knowledge DAP Furnace Process is a Plus
- Strong RF/MMIC process understanding is highly preferred.
- Lean Six Sigma exposure (Green Belt or above is advantageous).
- Strong statistical analysis capability (JMP, Minitab, or equivalent).
- Excellent communication skills in English (written and spoken).
- Ability to influence cross-functional and multicultural teams.
