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This Process Engineer responsible for sustaining and optimizing manufacturing processes, troubleshooting production issues, driving continuous process improvements, supporting new product introductions, and ensuring product quality, yield, productivity, and cost competitiveness in bonding wire manufacturing operations.
Job Responsibilities:
Job Requirement:
Job ID: 152908699
Skills:
Microsoft Office, ocap, process fine tuning, quality key performance index, Spc, FDC, real-time problem analysis, Engineering Qualification Evaluation, Tpm, wafer fabrication, defect median, recipe alignment, SWR DOE Trial R D, process specifications
Skills:
Microsoft Office, Agile, Engineering Sample DOE, Fmea, Prototype EVT, Parametric Yield improvement, Programming macro and scripting, Jmp, Statistical Process Control, 7 Qc Tools, defectivity, NPI Prototyping, process integration, Doe, RF filter products, CpK
Skills:
Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, Warpage characterization, System-in-Package SiP, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans
Skills:
Solidworks, Matlab, Python, Spc, Autocad, 8D, Six Sigma, dispensing and pick place process, Jmp, Statistical Process Control methodologies, Minitab, data analysis packages, Doe
Skills:
Matlab, Microsoft Excel, Python, Material characterization, Polymer molding, Data Analysis, JMP programming, Contact non-contact profilers, Metrology, Smartscope