Cu Clip Process Engineer

Responsible for both New Product Introduction (NPI) and sustaining manufacturing of Cu Clip packages, ensuring stable processes, high yield, quality improvement, customer satisfaction, and production readiness.

Key Responsibilities

1. New Product Introduction (NPI)

• Lead process development and qualification for new Cu Clip products.
• Drive package bring-up, process characterization, and product ramp activities.
• Define process parameters, process windows, and process control plans.
• Support DOE, risk assessment, and failure analysis during product development.
• Coordinate with Product Engineering, Quality, Manufacturing, and Customers for successful product release.

2. Sustaining Process Engineering

• Monitor and improve yield, quality, UPH, OEE, and process capability.
• Troubleshoot manufacturing issues and drive root cause corrective actions.
• Reduce scrap, defects, customer complaints, and production downtime.
• Support continuous improvement and cost reduction projects.
• Lead yield enhancement and productivity improvement programs.

3. Customer Interface

• Own assigned customer accounts from a process engineering perspective.
• Conduct regular technical discussions with customer engineering teams.
• Present yield, quality, reliability, capacity, and improvement updates.
• Support customer audits, qualifications, and issue resolution.
• Lead technical responses for customer complaints and engineering requests.

4. Training & Technical Leadership

• Train engineers, technicians, and production personnel.
• Develop SOPs, work instructions, and best practices.
• Mentor junior engineers on Cu Clip assembly technology.
• Drive standardization across products and manufacturing lines.

Process Knowledge Required

Strong understanding of:

• Wafer Saw
• Die Attach
• Clip Attach
• Reflow/Sinter Process
• Molding
• Deflash
• Plating
• Laser Mark
• Singulation
• Final Inspection

Specific Cu Clip knowledge:

• Clip material and design
• Bondline control
• Void control
• Die tilt and clip alignment control
• Wetting performance
• Reflow profile optimization
• Thermal and electrical reliability
• Process capability improvement
• Yield and defect reduction methodologies

Qualification

• Bachelor's or Master's degree in Engineering.
• 5-10+ years experience in Semiconductor Assembly.
• At least 3-5 years direct experience in Cu Clip process.
• Strong problem-solving skills (8D, DOE, SPC, FMEA, Minitab).
• Experience with customer technical discussions and audits.
• Good communication skills in English.
• Ability to lead cross-functional projects and factory improvement initiatives.