Manufacturing Manager

Summary

The Manufacturing Technical Lead (MTL) is responsible for driving operational execution and technical readiness for next-generation hardware programs from initial concept through mass-production handoff. Serving as the primary technical interface on the program team, the MTL bridges hardware design technical leads, software/firmware engineers, factory NPI managers, and global operations teams. This role owns the mitigation of manufacturing risks, the timely completion of hardware prototyping phases, and the enforceability of documentation and change controls across the product development lifecycle.

Detailed Description

1. Cross-Functional Technical Bridging

• Operational Gatekeeper: Translate highly complex engineering product intents and schematic parameters into practical, execution-ready directives for Factory NPI Managers and manufacturing sites.
• Operations Synthesis: Partner closely with internal Front-End, Back-End, and Test Engineering Senior Managers to ensure manufacturing infrastructure, SMT lines, box build automation, and test fixtures scale alongside prototyping phases.
• Design & Software Interface: Partner directly with hardware Design Technical Leads and Software Engineering Program Managers to align code, firmware, diagnostics, and silicon readiness with test schedules.

2. Build Prototyping & Plan Execution

• Execution Accountability: Own the execution matrix for all early-stage engineering and validation builds (Proto, EVT, DVT, PVT), ensuring builds complete on time and hit rigorous internal quality targets.
• Build-Specific SOW Authoring: Author and enforce precise build-specific Scopes of Work (SOW) defining clear hardware configuration baselines, build quantities, material allocations, and specific engineering test goals.
• Anomaly & Deviation Controls: Manage the live tracking, logging, and technical resolution of manufacturing anomalies, ensuring that engineering deviations are strictly controlled, documented, and closed.

3. Risk Mitigation & Governance

• Risk Framework Execution: Deploy NUDD (New, Unique, Different, Difficult) reviews, golden pFMEAs, and Critical-to-Quality (CTQ) parameter monitoring to prevent downstream yield and manufacturing shortfalls.
• Change Control Governance: Enforce rigorous change management protocols, representing operations at Change Control Boards (CCB) to ensure mid-cycle design tweaks or component substitutions are properly risk-assessed.
• Issue Tracking & Escalation: Utilize automated tracking frameworks (e.g., Jira) to monitor build blockers, spearheading immediate technical workarounds or executing crisp, timely escalations to management before critical paths are impacted.

Knowledge/Skills/Competencies

• Process Depth: Strong knowledge of electronic manufacturing operations (SMT, box build, system assembly, and test methodologies) paired with experience handling complex BOM structures and configuration lifecycles.
• Governance Tools: Proficiency with change control systems (PLM/CCB), bug/issue-tracking systems (Jira), and authoring detailed technical documentation such as Scopes of Work (SOWs).

Physical Demands

• Duties of the position are performed in a manufacturing environment with frequent exposure to noise, dust, chemicals, operating machinery, temperature extremes, hazardous substances, etc.
• Duties may require extended periods of sitting and sustained visual concentration on a computer monitor or on numbers and other detailed data.
• Repetitive manual movements (e.g., data entry, using a computer mouse, using a calculator, etc.) are frequently required.

Typical Experience

• 5+ years of experience in hardware NPI engineering, manufacturing technical leadership, or systems program management.

Typical Education

• Bachelor's degree in Electrical, Mechanical, Computer, or Industrial Engineering.
• Educational requirements may vary by geography.