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Process Engineer
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Process Engineer
Nxp Semiconductors- Posted 2 hours ago
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Job Description
Job Summary
Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Blade Dicing, Backgrind, or DBG processes.
Job Responsibility
Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Blade Dicing, Backgrind, or DBG processes.
Job Responsibility
- Define/optimize procedures to ensure smooth processing of production lots
- Develop and maintain process documentation and SOPs including operator training
- Lead root cause analysis for defects and yield losses
- Provide disposition on lots with quality issues
- Support new product introduction and process qualification
- Analyze production data to identify process improvements
- Collaborate with cross-functional teams on cost reduction and process improvement projects
- Perform change management including new material qualification
- Bachelor's or master's degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field).
- 3–5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process.
- Strong data analysis and problem-solving skills.
- Experience with Statistical Process Control (SPC) and process validation (preferred).
- With good command of English language.
- Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage).
More Info
Job Type:
Industry:
Function:
Employment Type:
Key Skills
Statistical Process Control (SPC)
New material qualification
Continuous improvement tools
Blade Dicing
Wafer Saw Dicing
About Company
Skills:
DOE (Design of Experiments), SPC (Statistical Process Control), FMEA (Failure Mode and Effects Analysis), Excel, Industrial Engineering, Word, Data Analysis, automatic equipment commissioning, Powerpoint, process improvement, Chemical Engineering, Materials Engineering, Electrical Engineering, Mechanical Engineering, Automation Engineering, automation tuning
Skills:
Statistical Process Control (SPC), Design of Experiments (DOE), laser alignment , Microsoft Office, Jira, Confluence, cycle-time reduction, data interpretation, Process Optimization, data-analysis tools, risk assessment methods, camera-based alignment, Jmp, Active Alignment processes, manufacturing problem-solving, Process Validation, quality assurance practices, Minitab, PFMEA control plans, fiber alignment, yield improvement, Process Capability Analysis, optical alignment
Skills:
Electrical Drawing, Problem solving analysis, Lean, Iso9001, Circuit, 5why, 8D, Casting Process, Statistic, Quality Control, Six Sigma, Implement new project in workshop, Brainstorming, ISO13485
Skills:
Excel, Ipc, Solidworks, wave soldering, thermal profilers, JEDEC, Fmea, Spc, Six Sigma, solder paste inspection systems, Lean Manufacturing, Minitab, Autocad, RoHS compliance, IPC-A-610, J-STD-001
Skills:
manufacturing processes , Solidworks, Automation, Data Analysis, CAD, Minitab, Lean Production, Six Sigma