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Process Engineer

Process Engineer

Nxp Semiconductors
3-5 Years
  • Posted 14 hours ago
  • Be among the first 10 applicants

Job Description

Job Summary:

Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Backgrind, or DBG processes.

Job Responsibility

  • Define/optimize procedures to ensure smooth processing of production lots
  • Develop and maintain process documentation and SOPs including operator training
  • Lead root cause analysis for defects and yield losses
  • Provide disposition on lots with quality issues
  • Support new product introduction and process qualification
  • Analyze production data to identify process improvements
  • Collaborate with cross-functional teams on cost reduction and process improvement projects
  • Perform change management including new material qualification

Qualification

  • Bachelor's or master's degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field).
  • 3–5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process.
  • Strong data analysis and problem-solving skills.
  • Experience with Statistical Process Control (SPC) and process validation (preferred).
  • With good command of English language.
  • Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage).

More information about NXP in Thailand...

More Info

Job Type:
Function:
Employment Type:

Key Skills

DBG processes

continuous improvement tools

Backgrind

Wafer Saw Dicing

About Company

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